发明名称 |
Tin-zinc solder connection to a printed circuit board or the like |
摘要 |
An electronic package comprises a component mounted on a substrate, such as a printed circuit board, by a solder connection that is based upon a tin alloy containing zinc. The connection is formed to copper faying surface on the substrate, and includes a first layer formed of a zinc-free tin metal bonded to the copper surface and a second layer formed of the tin-zinc solder alloy bonded to the first layer. The first layer provides a zinc-free barrier between the copper and the tin-zinc alloy to retard zinc migration to the copper interface that would otherwise result in dezincification of the solder alloy and reduce the mechanical properties of the connection.
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申请公布号 |
US5452842(A) |
申请公布日期 |
1995.09.26 |
申请号 |
US19940334905 |
申请日期 |
1994.11.07 |
申请人 |
MOTOROLA, INC. |
发明人 |
MELTON, CYNTHIA M.;WEITZEL, LINDA |
分类号 |
B23K35/00;B23K35/26;H05K3/34;(IPC1-7):H05K3/34 |
主分类号 |
B23K35/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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