| 摘要 |
<p>An improved leadframe (10) for packages of integrated power devices which, by virtue of its configuration, allows to press the dissipator (15) on the bottom of the shell during the molding of the plastic case (20), without the dissipator (15) having exposed portions of its inner face (which is in contact with the chip). In order to achieve this, the leadframe (10) according to the invention comprises a monolithic body which defines a perimetric frame (11), the leads (12) and the dissipator (15). The dissipator (15) extends in a depressed plane with respect to the frame (11) and is connected to the frame (11) and to the leads (12) in at least three step-like points (16a-16c) which are mutually spaced and non-aligned. During the molding of the plastic case (20), a pressure is exerted on the frame (11) and is transmitted to the dissipator (15) by the three step-like points (16a-16c), so that the dissipator is effectively pressed flat against the bottom of the mold without using pushers which pass through the plastic case (20). <IMAGE></p> |
