| 摘要 |
PURPOSE:To obtain a heat-resistant IC tray which is molded of a resin composi tion excellent in fluidity and moldability, is excellent in heat-resistance which allows using it at a specified high-temperature and durability for repeated use, and has a high accuracy in dimension and shape-stability without deformation such as warp, distortion, etc. CONSTITUTION:A resin composition, which contains a base material composed of. 40-100wt.% of aromatic polysulfone resin and 0-60wt.% of polycarbonate resin, 3-20wt.% of electroconductive carbon black and 2-20wt.% of mica powder, is injection-molded. |
