| 摘要 |
PURPOSE:To provide a heating element package capable of effective heat radiation of a heating element. CONSTITUTION:A package comprises a semiconductor element 1 generating heat, ceramic substrate 2, terminals 3, silicon gel 4, wires 5, a resin case 6, a connector part 7a of the package, and a connector part 7b of a harness 8a of a vehicle or the like. Since the ceramic substrate 2 mounting the semiconductor element 1 is loaded on the terminals 3, the heat generated from the semiconductor element 1 travels to the ceramic substrate 2 and the terminals 3, and is dissipated via inner conductors 8b of the harness. |
