发明名称 PRINTED CIRCUIT BASE MATERIAL AND ELECTRICAL CONNECTION STRUCTURE
摘要 PURPOSE:To provide a printed circuit base material excellent especially in high-frequency characteristics and lessened in DC leakage current and an electrical connecting structure capable of making an electrical connection of high density and reliability with a contacting conductor. CONSTITUTION:A first conductor pattern 4 is formed on the one side of a dielectric film 2, a second conductor pattern 8 is provided onto the other side of the film 2, and one or more fine conductor projections 6 are provided to a part of the first conductor pattern 4. At this point, the fine conductor projection 6 is 5 to 500mum in diameter and formed into a shape like a ball, a mushroom or the like.
申请公布号 JPH07245471(A) 申请公布日期 1995.09.19
申请号 JP19940062017 申请日期 1994.03.06
申请人 YOKOGAWA HEWLETT PACKARD LTD 发明人 HIWADA KIYOYASU
分类号 H05K1/11;H05K3/34;H05K3/40 主分类号 H05K1/11
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