| 摘要 |
PURPOSE:To prevent always subsequent control, and precisely measure the temperature of a power semiconductor element. CONSTITUTION:A power semiconductor module 21 consists of a semiconductor module fixing board 211 on which a power semiconductor element 10 is fixed via solder 101 and an element mounting board 102, and a semiconductor module case 213 which confines silicon gel 212 for protecting the power semiconductor element 10, and is fixed to a cooling plate 18 with fastening screws 214. A thermocouple 12 as a temperature detecting means is arranged just under the power semiconductor element 10, through a hole which is formed in the semiconductor module fixing board from the horizontal direction so as to evade the fixing screw 214. |
