CURABLE POLYMERIC COMPOSITION AND USE IN PROTECTING A SUBSTRATE

摘要

A curable poymeric composition (6) which is a liquid at 20 DEG C and which comprises 25 to 60 % by weight of a resin component which comprises an epoxy, 5 to 25 % by weight of a curing agent which comprises two components, a first component which is a cycloaliphatic amine or an aromatic amine, and a second component which is a polyamide amine, and 20 to 65 % by weight of an inert inorganic filler. The curable composition (6) can be used in a method of protecting a substrate such as a pipe (4) or a pipe joint from corrosion or mechanical damage. In the method, the curable composition (6) is first applied to the substrate (4), a polymeric covering layer (2) is applied over the curable composition with an innermost layer of a heat-activatable sealant (8) in intimate contact with the curable composition, and the curable composition is then cured. During the curing process, the heat-activatable sealant, e.g. a hot melt adhesive, remains in contact with the curable composition and interacts therewith.