Jig for measuring the characteristics of a semiconductor, manufacturing method therefor and use thereof.

摘要

A jig for measuring various semiconductor devices, a manufacturing method for the jig, and a method for using the jig which are economical and which makes it possible to efficiently measure the characteristics of various semiconductor device by use of the jig. The jig comprises a first circuit board (1), an intermediate board (2), and a second circuit board (3). The first circuit board (1) includes a first group of terminals (11) to be connected to a measuring instrument or a power supply or the like, a second group of terminals (13) to be connected to the second circuit board (3), and a group of wiring conductors (12) for making electrical connection between the aforesaid two groups of terminals. The second circuit board (3) has a third group of terminals (31) which is connected to the first circuit board (1) and which is located in a position corresponding to the position of the second group of terminals (13) of the first circuit board (1), a fourth group of terminals (33) to be connected to a semiconductor device to be mounted at least on the circuit board or to the socket for connection with a semiconductor device, and a group of wiring conductors (32) for making electrical connection between the third and fourth groups of terminals (31, 33). The intermediate board (2) has an insulated board provided with a plurality of through holes (21) in the places corresponding to the places of the second and third groups of terminals and it also has springy pins (22) which are installed in the plurality of through holes and isolated from the inner walls of the through holes.