发明名称 Method of treating a workpiece with a plasma and processing reactor having plasma igniter and inductive coupler for semiconductor fabrication
摘要 A plasma generator for the fabrication of integrated circuit devices is described. The generator includes a separate plasma igniter electrode to apply the electrical power to a gas within a treatment chamber necessary to create a desired plasma. The plasma, once it is initiated, then is sustained by inductive coupling.
申请公布号 US5449432(A) 申请公布日期 1995.09.12
申请号 US19930141803 申请日期 1993.10.25
申请人 APPLIED MATERIALS, INC. 发明人 HANAWA, HIROJI
分类号 H05H1/46;C23F4/00;H01J37/32;H01L21/205;H01L21/302;H01L21/3065;(IPC1-7):H05H1/00 主分类号 H05H1/46
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