MULTILAYER INTERCONNECTION BOARD AND METHOD AND DEVICE FOR MANUFACTURING MULTILAYER INTERCONNECTION BOARD

摘要

PURPOSE:To reduce cost by collectively laminating multilayer substrates and simultaneously solve fine and high-density wiring by connecting especially a member for joint to the surface wiring of a second insulation film via an alloy layer consisting of a metal which is the material of the member for joint and a conductor. CONSTITUTION:An insulation film 1 to be laminated is provided with a wiring 2 on either front or back surface and a via hole 4 whose one edge part 3 is connected to the wiring 2 and the other edge part 3 is penetrated through the other surface. The insulation film 1 is laminated via an adhesive layer 6 with an adhesive curing object. The edge part 3 which is not connected to the wiring 2 of the via hole 4 of the first insulation film 1 is covered with a member 5 for joint consisting of a metal or an alloy which is different from a conductor for forming the wiring 2. The member 5 for joint is connected to the wiring 2 on the surface of the second insulation film 1 via an alloy layer consisting of a metal or an alloy which is the material of the member 5 for joint via an alloy layer consisting of the conductor, the member of the wiring 2, thus reducing cost and achieving a high-density wiring due to collective lamination.