| 摘要 |
The process uses a rigid structure (40) such as a metallic grid or network of fibres with precise dimensions placed on the supporting material (40). The sensor (10) is held against the rigid structure (20) while a bed of adhesive (50) is laid which fills the gaps in the rigid structure (40). The adhesive is polymerised to fix the sensor permanently in position. The sensor can be connected electrically by wires to an adjacent electronic circuit (30). The complete assembly is encapsulated for mechanical protection.
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