| 摘要 |
An IC socket comprises an IC package receiving portion, a plurality of contact members arranged along the IC package receiving portion, and a contact shutter member for displacing the contact members between a position for contacting leads of the IC package and a releasing position. The improvement comprises a lifter operatively connected to the contact shutter member so as to be displaced between a position above and a position below the contacting position. The lifter receives the IC package in the position above the contacting position and delivers the IC package onto a support platform of the IC package receiving portion while being displaced to the position below the contacting position.
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