Semiconductor flipchip packaging having a perimeter wall

摘要

A semiconductor device contains a semiconductor chip and a circuit board. The chip has a first surface at which the main region is formed. On the surface, a plurality of chip electrodes and a perimeter electrode surrounding the chip electrodes are formed. Bumps and a wall member made of solder metal are formed on the chip electrodes and frame-shaped electrode, respectively. The circuit board has a first surface facing the first surface of the chip. On the first surface of the circuit board, a plurality of board electrodes and a perimeter electrode are placed so as to correspond to the chip electrodes and the perimeter electrode. In a state where the chip and the board face each other, heat treatment is performed to connect the bumps and wall member to the board simultaneously by reflow. The wall member connects the chip to the board while surrounding the main region and the bumps continuously, to form essentially a closed space between the chip and the board.