| 摘要 |
PURPOSE:To provide a method for manufacturing circuit substrate capable of keeping good flatness on the surface of circuit substrate without level difference by preventing a clear resin conventionally generated in the periphery of conductors for a large current circuit when forming a circuit substrate for a large current by using a prepreg sheet. CONSTITUTION:A pattern groove for a shape of a circuit pattern for a large current is punched in an insulating substrate 1A, and a circuit conductor 3 for a large current with the thickness almost the same as that of the insulating substrate 1A is inserted in this pattern groove. A prepreg sheet 7 is laminated on this insulating substrate 1A and further a single-sided copper-clad laminated material 1B is laminated on the prepreg sheet 7. From this state, the layer is heated and pressured from the top and bottom with a hot press, and prepreg sheet 7 is hardened. Moreover, the copper foil on the single-sided copper-clad laminating material 1B is etched and a signal circuit pattern is formed there. |
