| 摘要 |
PURPOSE:To provide a TCP wherein bonding strength of a lead and a bump is sufficient and short-circuit is not generated between leads. CONSTITUTION:A semiconductor chip 16 is rectangular. Bumps 17A, 17B are arranged zigzag in the vicinity of at least one side of the semiconductor chip 16. As to the bump 17A out of the bumps 17A, 17B which is arranged outside a semiconductor chip, the maximum width in the direction parallel to at least one side of the semiconductor chip is Bw1. As to the bump 17B out of the bumps 17A, 17B which is arranged inside the semiconductor chip, the maximum width in the direction parallel to at least one side of the semiconductor chip is Bw2. Then the relation Bw2> Bw1 is satisfied. |
