| 摘要 |
A compound for bonding to a horse's hoof is disclosed. The invention comprises a particulate compound comprising at least a first ground up polymer (12) and an adhesive compound (14) for bonding with the ground up polymer (12). The present invention is also directed to a novel method for leveling the hoof of a horse. The method comprises the following steps cleaning the bottom of the hoof to remove impurities, applying an adhesive bonding agent (14) to all voids (16) in the hoof and lowering the hoof with bonding agent (14) into a ground up polymer (12) or polymers, which ground up polymer (12) bonds to the bonding agent (14) such that the loose particles (12) with the bonding agent (14) fill all voids (16) in the hoof. A shoe (20) constructed from the inventive hoof repair compound also is disclosed. |
