| 摘要 |
PURPOSE:To prevent connection defects by soldering an earth pattern and an electric connection terminal integrally by solder dip for increasing solder quantity. CONSTITUTION:Close to a hole 2 in a printed board 2 to which a lug terminal 5 is inserted. small holes 9a, 9b are formed, and an earth pattern 4 is formed to surround the hole 2 and the small holes 9a, 9b. A bent part 7 of the lug terminal 5 is inserted into the hole 2, and in the condition where a wire material 10 is inserted into the small holes 9a, 9b, solder dip is performed. The printed board 1 on which an electronic part of the wire material 10 is mounted is formed on a surface on the opposite side of the earth pattern 4 to be soldered through the hole 2 and the small holes 9a, 9b. At this time. solder 8 is placedincluding the bent part 7 and the wire material 10, so solder quantity is increased to eliminate connection defects, thereby generation of cracks can be prevented. |
