SPUTTERING METHOD AND APPARATUS FOR DEPOSITING A COATING ONTO SUBSTRATE

摘要

Sputtering method and apparatus for depositing a coating onto substrate (14') employs variable magnetic field (H) arranged in vicinity of a cathode (4) within a working chamber (1), filled with ionizable fluid. By controlling a magnetic field (H) topology, i.e. orientation and value of magnetic strength with respect to cathode (4), there is enabled localization and shifting of plasma (15) away from substrate (14') and thereby improvement of adhesion and properties of deposited coatings.