| 摘要 |
PURPOSE:To make the high density package of semiconductor integrated circuit chips feasible on a substrate by a method wherein, in order to connect semiconductor integrated circuit chips with one another, two semiconductor integrated circuit chips to be connected are arranged with a specific wiring or electronic part interposed between the chips. CONSTITUTION:Specific functional bare chips 13a, 13b in approximate state with a wiring pattern 12 interposed between the chips are mounted on a substrate 11 using a specific diebonding materials 14a, 14b. At this time, these two bare chips 13a, 13b are connected by directly connecting the bonding pads 15a, 15b arranged in corresponding relation on respective surfaces by bonding wires 16 comprising aluminum etc., through the intermediary of an underneath wiring pattern 12. Through these procedures, the two bare chips 13a, 13b in approximate state with the wiring pattern 12, etc., interposed between the chips can be composed on a substrate 11 thereby enabling the high density package of the chip 13a, 13b to be made feasible. |
