| 摘要 |
PURPOSE:To bond a work by pure water by bonding an outer periphery of a soft plate formed with a soft member to a base plate and also remove it easily and reduce initial cost of a polishing machine and reduce polishing cost per one VLSI. CONSTITUTION:A through groove 2 for jetting fluid intermittently is bored in nearly center of a base plate 1 pivotaly attached to a one rotary shaft. Then, an outer periphery of a soft plate formed with a soft member is bonded to the base plate 1 and nonpolished surface of a work W is bonded to the soft plate by fluid such as pure water. The work W is embraced by the other polishing plate pivotally attached to the rotary shaft and polished. The base plate 1 and the polishing plate are removed from the work W after the work W is polished and fluid, for example pure water is jetted from the through groove 3 of the base plate 1 and a fluid storage portion A by pure water is formed between the base plate 1 and the soft plate 3. Thereby, the soft plate 3 is deflected and swelled and the work W is removed. |
