Plastic mold package device decapsulator with flat, separate etch head and etch plate

摘要

A decapsulation embodiment of the present invention comprises clamping a device-under-test to a fixture with a non-recessed etch head. The fixture has an etch plate with a hole that defines the area on the device-under-test for the decapsulation. Electrical access is provided to the package pins of the device-under-test. The fixture comprises a support with connections for the pins and the etch-resistant etch plate on top with the hole for locating over the site of the active die within the device-under-test package. The hole is sized to define the proper dissolved opening dimensions for decapsulation and is deep enough to enable decapsulation to start and yet not so deep that fresh etchant solution cannot reach the surface of the device-under-test. The device-under-test is placed on top of the support and covered with a etch plate. The whole assembly is then clamped together.