PHOTOSENSITIVE RESIN COMPOSITION

摘要

PURPOSE:To obtain a photosensitive resin compsn. having negative photosensitivity which can be subjected to microfabrication by directly irradiating with electromagnetic waves. CONSTITUTION:This photosensitive resin compsn. is obtd. by adding a compd. (B) having carbonyl group and a tertiary amine in one molecule which can be photo-crosslinked by irradiating a polymer having a repeating unit expressed by the formula with electromagnetic waves. In the formula, A is a quadrivalent org. group having at least two carbon atoms, R1 is a univalent org. group having at least one carbon atom, hydrogen atom, or a halogen atom, and (n) is an integer >=10. The amt. of the compd. (B) is 0.2 to 2.0mol equiv. to the carboxylic acid group of the polymer. This photosensitive resin compsn. is used as an electric insulating material and can be used for an insulating layer of an electronic device.