Photosensitive polyimide precursor composition

摘要

A photosensitive polyimide precursor composition of the present invention comprises a polyimide precursor represented by the formula (6) (OR5)kR43-kSi-R3-X-Z(6) and having a logarithmic viscosity number of 0.1 to 5.0 dl/g measured in N-methyl-2-pyrrolidone at 30 DEG C. and a compound capable of generating an acid by light irradiation, said polyimide precursor being obtained by reacting A mol of a tetracarboxylic dianhydride, B mol of a diamine, and C mol of an aminosilane so as to meet the relations of the equations: <IMAGE> <IMAGE> This composition not only has practical photosensitivity but also inhibits the reduction of film thickness due to curing and development, and it is also excellent in shelf stability in varnish and adhesive properties to a substrate such as a silicon wafer or the like.