发明名称 |
Apparatus for thermally coupling a heat sink to a leadframe |
摘要 |
A molded plastic package for an integrated-circuit die includes a lead frame having a central die-attach paddle. One side of the die-attach paddle has an integrated-circuit die fixed thereto. A heat sink member is resiliently fixed to the other side of the die-attach paddle using a layer of viscous thermal grease between the heat sink member and the other side of the die-attach paddle. One or more holes are formed in the lead frame and are engaged by corresponding studs on the heat sink. The stud has a shoulder portion which engages the lead frame to prevent the stud from further passing through the hole in the lead frame. |
申请公布号 |
US5442234(A) |
申请公布日期 |
1995.08.15 |
申请号 |
US19940232573 |
申请日期 |
1994.04.21 |
申请人 |
VLSI TECHNOLOGY, INC. |
发明人 |
LIANG, LOUIS H. |
分类号 |
H01L23/36;H01L23/40;H01L23/433;H01L23/495;H01L23/50;H01L33/00;(IPC1-7):H01L23/48;H01L29/44;H01L27/52;H01L29/60 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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