| 摘要 |
PURPOSE:To provide a manufacturing method of a printed wiring board capable of obtaining a printed wiring board of high reliability wherein short-circuit and peeling or the like of a circuit are not generated when a device hole is worked after the circuit is formed, in a printed wiring board on which a semiconductor chip wherein high density and high reliability are required is mounted. CONSTITUTION:In the manufacturing method of a printed wiring board wherein a circuit 2 is formed on the surface of a printed wiring board 1, and a device hole 8 is formed after first resist 5 is stuck on the circuit 2, second resist 6 is stuck on the first resist 5 in the peripheral part of the device hole 8. |
