发明名称 MULTILAYER FLEXIBLE PRINTED WIRING BOARD AND MANUFACTURE ITS THEREOF
摘要 PURPOSE:To efficiently manufacture a multilayer flexible printed wiring board which is lightweight and thin-walled. CONSTITUTION:A conductor pattern 12 is provided onto both sides of a flexible base film 11, and a film overlay 13 is laminated on both the sides of the flexible base film 11. Then, an adhesive agent layer 14 provided with an opening 14a which makes the center of the film overlay 13 exposed is laminated on the film overlay 13, and a conductor layer 15 is laminated on all the surface of the adhesive agent layer 14 so as to cover the opening 14a. A through-hole is provided so as to electrically connect the conductor layer 15 with the conductor pattern 12, and the inner circumferential surface of the through-hole is plated with copper for the formation of a through-hole 19 through which the conductor layer 15 is electrically connected with the conductor pattern 12. Thereafter, the conductor layer 15 is etched into a conductor pattern 15a of prescribed pattern.
申请公布号 JPH07212046(A) 申请公布日期 1995.08.11
申请号 JP19940005946 申请日期 1994.01.24
申请人 SHARP CORP 发明人 OHATA TAKAFUMI
分类号 H05K3/42;H05K3/06;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/42
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