| 摘要 |
<p>PURPOSE:To obtain a semiconductor device, wherein leads and a metal heat sink are plated readily by only connecting plating electrodes to a lead frame, and a small step part for chip mounting for a high matching circuit on the metal heat sink in the vicinity of the chip mounting part of the semiconductor. CONSTITUTION:A bonding member 100, which is provided at a lead frame, is bonded on a metal heat sink 10. Plating electrodes are connected to the lead frame. The plating electrodes are electrically connected to leads 42a and 42b provided at the lead frame, to the bonding member 100 and to the metal heat radiator 10, to which the bonding member is bonded. At the same time, a protruding part 18 is provided by using the bonding member 100, and a small step part 16 is provided on the metal heat sink 10 in the vicinity of the bonding member 100. A low semiconductor chip 60 and a high matching circuit chip 50 are mounted on the protruding part 18 and the small step part 16.</p> |
