| 摘要 |
PURPOSE:To obtain a semiconductor device having a structure wherein reliability is not deteriorated by the thermal stress generated by a semiconductor element. CONSTITUTION:A semiconductor element 4 is mounted on a metal frame 1 wherein a region for mounting the semiconductor element 4 is constituted as a recessed part or a surrounded structure by a wall. After the semiconductor element 4 is covered with resin, plastic molding is performed. The thermal stress of resin 8 is prevented from exerting influence upon the semiconductor element, and a plastic molded type semiconductor device of high reliability can be obtained. |
