发明名称 MOLD AND METHOD FOR MOLDING SUBSTRATE
摘要 PURPOSE:To prevent the generation of bit shift and double transfer by sucking the rear surface of a stamper from a mold to hold the surface and peripheral end surface of the stamper to a non-contact state with respect to the mold and setting the part facing to the cavity of the mold prescribing the outer peripheral side surface of a substrate to be molded to a specfic angle with respect to a stamper attaching surface. CONSTITUTION:The rear surface of a stamper 14 is sucked by the suction hole 13 provided to a mold 11 to fix the stamper 14 to the mold 11 in a close contact state. Outer and inner periphery holders 15, 16 are provided to the outer and inner peripheral parts of the stamper 14 but not brought into contact with the surface and peripheral end surface of the stamper 14 to be held to a non-contact state. Further, the inner surface 16a of the holder 16, in other words, the part facing to the cavity of the mold prescribing the outer peripheral surface of a substrate is set to an angle + or -3 deg.C from perpendicularity with respect to the attaching surface of the stamper 14. The operation of air supplied from the slit 25 on the side opposite to the stamper is made simultaneous or delayed with respect to the operation of air supplied from the slit 26 on the side of the stamper.
申请公布号 JPH07205200(A) 申请公布日期 1995.08.08
申请号 JP19940001664 申请日期 1994.01.12
申请人 MITSUBISHI CHEM CORP 发明人 TAMURA TAKANORI;YOKOTA SHOJI
分类号 B29C45/26;B29C45/43;B29D17/00;B29L17/00;G11B7/26;(IPC1-7):B29C45/26 主分类号 B29C45/26
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