| 发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURE METHOD |
| 摘要 |
The method comprises the steps of connecting the leads of lead frame to fix the leads; preventing epoxy from overflowing when molding by using a dam bar, a step of forming a package by epoxy molding to reduce a number of process; and forming the dam bar which is separated 0.1˜0.25nm from the package.
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| 申请公布号 |
KR950008850(B1) |
申请公布日期 |
1995.08.08 |
| 申请号 |
KR19920006932 |
申请日期 |
1992.04.24 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
AN, MIN - CHOL;LEE, SANG - HYOK;SHIN, SANG - HYOK |
| 分类号 |
H01L23/48;H01L23/50;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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