| 摘要 |
<p>PURPOSE:To fine down the pitches of the tip of the conductor wiring of a semiconductor chip mounter. CONSTITUTION:The first layer wiring board 10 is provided with an aperture 11 at the center, and a through hole 12 in the vicinity of the periphery. An adhesive layer 14 is provided near the periphery of the first wiring board, and the tip of the inner lead 31a of a lead frame 30 is arranged on and bonded to the through hole 12. The first wiring board is soaked in solder bath, and solder junction is made between the lead frame and the through hole by the solder having gone up through the through hole. The second wiring board 20 is provided with an aperture 21 larger than the aperture 11 at the center, and is provided with a through hole 22 in the vicinity of the periphery. The second wiring board is bonded onto the first wiring board and the lead frame, and solder junction is made between the lead frame and the through hole. The peripheral wall of a chip mounter is provided with a step, and this step is made the connector terminal for wire bonding, whereby the terminal pitches are roughly doubled substantially.</p> |
