| 摘要 |
<p>PURPOSE:To improve the quality and reliability of a product by eliminating horizontal or vertical deviations of leads. CONSTITUTION:A manufacturing method for a semiconductor device is as follows: a lead frame to which tips of a plurality of leads 1 are linked by a coupler 3 is manufactured; a film 4 coated with adhesive is thermo-compression bonded to fix the tips of the plurality of leads 1; a downset process is applied to the tips of the plurality of leads 1 to form downset parts 2 at the plurality of leads 1; and the coupler 3 of the tips of the plurality of leads 1 is cut.</p> |
