发明名称 SURFACE MOUNT METHOD
摘要 PURPOSE:To enhance reliability in soldering by heating the connectors individually using a heating jig prior to soldering to a printed board thereby preventing the dielectric strength of connector housing from deteriorating. CONSTITUTION:Cream solder is fed onto a solder pad 5a for mounting a connector 4 which is then mounted on a printed board 5 such that the solder terminal part 7b of a conductive contact, press fitted in the connector 4, comes into contact with the solder pad 5a. A heating jig 1 is then inserted into the connector 4 such that the heating jig 1 comes into contact, on the bottom face thereof, with a part of the housing 6 designated by a reference number 8. Heat fed to the contact part 3a of a heating block 3 is transmitted to the resilient contact part 7a of the conductive contact press fitted in the housing 6 of the connector 4 thence to the solder terminal part 7b. Since the heat has temperature higher than the melting point of cream solder, the cream solder is fused and the connector 4 is mounted on the printed board 5.
申请公布号 JPH07202415(A) 申请公布日期 1995.08.04
申请号 JP19930335680 申请日期 1993.12.28
申请人 NEC CORP 发明人 YOSHINO TOSHINORI
分类号 H01R43/00;H05K1/18;H05K3/34;(IPC1-7):H05K3/34;H01R9/09;H01R23/68 主分类号 H01R43/00
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