发明名称 SYSTEM FOR PACKAGING MULTI-CHIP MODULE
摘要 PURPOSE: To provide a means which uses standard interconnector chips and an automatic tape sticking frame. CONSTITUTION: A logic cube 10 contains a baseplate 12, having two backs 14 fitted vertically. To these backs, a plurality of boards 16 stacked horizontally are coupled by connectors 18. Between each pair of adjacent substrates, a sufficient gap for ensuring the flow of heat dissipating air or a fluid flow is provided. Usually, these boards are multi-chip modules having a plurality of logic chips and interconnector chips attached at die mounting locations.
申请公布号 JPH07202117(A) 申请公布日期 1995.08.04
申请号 JP19940286305 申请日期 1994.11.21
申请人 A T & T GLOBAL INF SOLUTIONS INTERNATL INC 发明人 HARORUDO ESU KURAFUTSU
分类号 H01L25/00;H01L23/50;H01L25/065;(IPC1-7):H01L25/00 主分类号 H01L25/00
代理机构 代理人
主权项
地址