COOLER FOR SEMICONDUCTOR DEVICE

摘要

PURPOSE:To provide a cooler for a semiconductor device which can equally and efficiently cool each semiconductor device in the case that a plurality of semiconductor devices are attached to a heat absorbing block. CONSTITUTION:Semiconductor modules 12a-12d are attached longitudinally in a row to the main face of a heat absorbing block. Out of these, the semiconductor modules 12a and 12c, and 12b and 12d constitute the same electric circuits, forming groups severally. One end each of two heat pipes 13a and 13b are buried nearly in parallel with the main face of the heat absorbing block 11. One heat pipe 13a is buried so that the end on evaporation side may reach the position corresponding to the semiconductor module 12d. The other heat pipe 13b is buried so that the end on evaporation side may reach the position corresponding to the semiconductor module 12c. One hundred heat radiation fins 14 are mounted at the ends on condensation sides of the heat pipes 13a and 13b projected from the heat absorbing block 11.