| 摘要 |
PURPOSE:To enable a two-layered dry peel development type photoresist compris ing positive and negative photoresists to exhibit its regist characteristic to a maximum and to eliminate the need for disposing of waste liquid such as a developer by exposing the photoresist, and peeling the same for development. CONSTITUTION:A substrate l is laminated with a negative dry film 2, and a positive photoresist 3 is applied to the film 2, and after preliminary heating, the photoresist 3 is laminated with a base film 4. A photomask 5 is placed on the base film 4 for UV radiation 6. A heat treatment is carried out to bond a resist-forming part (the exposed part of the negative dry film)2a to the substrate 1 and to bond the unexposed part 2b of the negative dry film which serves as a peeling layer to the unexposed and exposed parts of the positive photoresist. The unexposed part 2b of the negative dry film which serves as a peeling layer is peeled for development, together with a cover film. Further, a resist pattern 7 is formed on the substrate 1 by post-curing. |
