| 摘要 |
PURPOSE:To make it possible to reduce the size and thickness and also to avoid lead deformation. CONSTITUTION:A base film 3 of a film carrier 2 has an elementmounting portion 3a and a lead holding portion 3b, and an inner end portion 4a of a conductor lead 4 and a tip portion 4b are supported by the element-mounting portion 3a and the lead holding portion 3b. Side of a circuit surface 1a of the semiconductor element 1 is adhered to the top of the element-mounting portion 3a, and part between both ends 4a and 4b of the conductor lead 4 is connected to the electrode portion of the semiconductor element 1 through a bump 5. When sealing by a resin mold 6, the lead tip portion 4b held by the lead holding portion 3b is exposed from a bottom face 6a of the resin mold 6 and is fixed to the bottom face 6a. External leads can be arranged in a short form without deformation without cutting the lead tip portions 4b, that is, the external leads, and the occurrence of oxidation and burrs on the end surface can be prevented thereby permitting good junction during mounting to a substrate or the like. |
