| 摘要 |
PURPOSE:To collectively suck chip parts for increasing fitting speed by performing vacuum suction of positioned chip parts and at the same time connecting a chip suction head part with a plurality of vacuum suction nozzles which can be rotated up and down to an XY table for retaining a printed circuit board at a substrate table part. CONSTITUTION:Chip parts whose positions are regulated in a number of rows by a chip positioning part are sucked and taken out by a suction nozzle 39 simultaneously in a number of rows. The suction nozzle 39 is installed at the tip of stepped shaft 33 and can be rotated up and down while the chip parts are sucked. Then, the shaft 33 with steps causes a slide table 41 to slide up and down by an up/down motor 35 and a crank 31 and the up/down movement is enabled by hooking the part of a neck 42 the stepped shaft 33 to the tip of an electromagnetic solenoid 32 via a hook 40. Further, by inserting a positioning pin 48 into a printed circuit board 50, the printed circuit board 50 is positioned and retained at a table 47, thus fitting chip parts speedily at one time. |
