发明名称 PLATED MATERIAL TREATING DEVICE
摘要 <p>PURPOSE:To provide a plated material treating device capable of rapidly heating plated materials, removing plating metal with high efficiency from these plated materials, suppressing generation of harmful materials such as zinc oxide, recovering this plating metal with high efficiency and obtaining iron having good purity. CONSTITUTION:This plated material treating device has a vessel body 1 which is provided with a plated material charge port 5 in the upper part, is provided with a gas introducing pipe 8 for introducing a reducing gas or inert gas and an iron scrap take-out port 10 in the bottom and can be reduced in pressure, a fluidized sand circulating means 2 which is disposed at this vessel body 1 and supplies the fluidized sand (s) flowing out of the vessel body 1 again to the inside of the vessel body 1, a fluidized sand heating means 3 which is disposed at this fluidized sand circulating means 2 and heats the fluidized sand (s) and a metal capturing means 4 which is disposed at the vessel body 1 and captures the evaporated plating metal. As a result, the generation of the harmful materials such as zinc oxide is suppressed.</p>
申请公布号 JPH07197136(A) 申请公布日期 1995.08.01
申请号 JP19930352249 申请日期 1993.12.29
申请人 ISHIKAWAJIMA HARIMA HEAVY IND CO LTD 发明人 MIYASAKA KIYOTO
分类号 C22B1/00;C22B7/00;C22B19/30;(IPC1-7):C22B1/00 主分类号 C22B1/00
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