| 摘要 |
Thie package allows more than two semiconductor chips to be placed in one package by using Chip on Lead (COL) structure, to reduce production costs, and to fabricate a plastic package that can contains the different type of semiconductor chips. The package comprises a lead frame which has many leads, a bonding tape placed for insulating electrically so that the middle pad of the lead frame is exposed; and various semiconductor chips on the bonding tape on the lead frame, to allow the lead frame and each of the semiconductor chips to be wire-bonded.
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