SEMICONDUCTOR PACKAGE PRODUCT DEVICE

摘要

The device prevents soft solder, exposed when spreading onto the external lead of semiconductor package, from spreading to a tie bar and increases reliability when placing the package on the printed circuit board. This device comprises of a container which contains an unstable soft solder, a pressure applying unit which makes the soft soler flow in one direction, a transferring unit which helps the soft solder spreading to an external lead, and a nozzle which is to form waves on the surface of the upper part of the soft solder and not to make the soft solder spread to the projected tie bar by having the body of package curved.