METHOD FOR STICKING WAFER

摘要

PURPOSE:To stick a wafer to a sticking plate without leaving any pressing mark on the surface of the wafer nor allowing bubbles to get in between the wafer and sticking plate. CONSTITUTION:After a wafer 2 coated with an adhesive 10 on its lower surface is sucked and held by a vacuum chuck 3, the lower end of a hood 4 surrounding the wafer 2 is brought into contact with a sticking plate 5 and the space 6 surrounding the wafer 2 is evacuated. The degree of vacuum to be attained in the space 6 is higher than that of the chuck 3. Therefore, the wafer 2 drops down from the chuck and is stuck to the plate 5 at the moment the degree of vacuum in the space 6 exceeds that of the chuck 3.