| 摘要 |
In a method of coating or sealing electronic components and component groups using single-component reactive resin mixtures which are storage-stable at room temperature for several months, reactive resin mixtures are used which contain the following components: � ���- a cationically curable solvent-free epoxy resin, ���- a triarylsulphonium salt with hexafluorophosphate, hexafluoroarsenate or hexafluoroantimonate as anion, in a proportion of 0.01 to 5% by weight (based on epoxy resin) and ���- a benzylthiolanium salt with hexafluorophosphate, hexafluoroarsenate or hexafluoroantimonate as anion, in a proportion of 0.01 to 5% by weight (based on epoxy resin), and ���- conventional additives if required. � These reactive resin mixtures are cured by UV radiation and heat. |
