| 摘要 |
PURPOSE:To obtain a boiling/cooling unit in which the size can be reduced without sacrifice of heat dissipation characteristics by fixing a condensation accelerating means for increasing the heat transfer area in a heat-exchanger. CONSTITUTION:A heating element, i.e., a semiconductor element 70, is set in a tank 20 to be cooled and sufticient quantity of refrigerant 60 is injected to immerse the semiconductor element 70 therein. An aluminium tube 102 having flat cross-section is fixed airtightly to the upper part of the cooling tank 20 with the upper opening being enclosed. Aluminium corrugated fins 101 are jointed to the side face of the cooling tank 20 thus forming a heat dissipating part, i.e., a heat-exchanger 10. Wavy inner fins 140 are disposed in the heat- exchanger 10. This structure retards the growth of liquid film 150 while increasing the inner surface area of heat-exchanger 10 thus decreasing the thermal resistance of the liquid film 150. |
