| 摘要 |
A semiconductor device having i) a common opening 110 reaching a conductive region 105 through at least one conductive layer 107 and ii) another conductive layer 109 deposited in the opening 101, the conductive layer 107 and the conductive region 105 being electrically connected in the common opening 110. Also disclosed is a process comprising previously forming a plurality of conductive regions 105 and 107, thereafter forming an opening 110 that opens at the conductive regions, and depositing another conductive region 109 in the opening 110 to electrically connect the respective conductive regions in the opening. This can achieve a wiring connection structure that enables prevention of an increase in the number of masks used to form openings for wiring connection, an increase in the number of steps and an increase in the area held by openings, to thereby enhance the degree of integration of semiconductor devices. <IMAGE> |
