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发明名称
Verfahren zum Durchführen von Burn-in-Prozeduren an Halbleiterchips
摘要
申请公布号
DE4400118(A1)
申请公布日期
1995.07.06
申请号
DE19944400118
申请日期
1994.01.04
申请人
SIEMENS AG, 80333 MUENCHEN, DE
发明人
HUEBNER, HOLGER, DR., 85598 BALDHAM, DE;WEBER, WERNER, DR., 80637 MUENCHEN, DE
分类号
G01R31/28;H01L21/3205;H01L21/66;H01L21/82;H01L21/822;H01L23/52;H01L27/04;(IPC1-7):H01L21/66;H01L21/768;H01L23/528
主分类号
G01R31/28
代理机构
代理人
主权项
地址
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