| 摘要 |
PURPOSE:To reduce the total thickness of a semiconductor device and a printed board by installing an opening to a printed board and fixing a semiconductor device whose one side is larger than the size of the opening with the opening and fixing a semiconductor device on the rear surface and circuit-connecting each of the semiconductor devices with a pattern. CONSTITUTION:An opening is installed to a printed board 17 which forms a pattern available from both the front and rear sides. A semiconductor device 11 whose one side is larger than the size of the opening, is loaded on the front side-printed board 17 by way of an adhesive 15 and a rear side-semiconductor device 12 is loaded on the front side-semiconductor device 11 by way of an adhesive 15. After the loading, each of the semiconductor devices 11 and 12 is connected to a pattern 19 with a bonding wire 13. Then, the both sided semiconductor devices 11 and 12 are resin-sealed with a bonding material 14. This construction makes it possible to provide a semiconductor device whose total thickness is thin even when a plurality of semiconductor device are incorporated. Further, this construction is applicable to electronic equipment that demands for a small size and a thin type device.
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