| 摘要 |
PURPOSE: To solve problems associated with manufacturing and defamation by manufacturing a base plate in the form of a metallic sheet, which is thermally contacted at its upper surface with a semiconductor chip and which has cut parts bent toward a lower side of an upper side region of the base. CONSTITUTION: This base plate is thermally contacted at its upper side with a semiconductor chip 1, and a lower side 15 of the base is set to be on the same plane as a main surface of a package. The base plate is made in the form of a metal sheet, which has cut parts bent to the lowers side of the upper side region of the base. For example, the entire base plate is made of a metallic sheet having a thickness of 0.8 mm, the sheet is cut in its central part into a square shape, and the corners of the squarer-forming tongue parts 15 are bent downwards, so as to be positioned on the lower side of the sheet. Further, the lower sides of a base part 10 provided on its outside are positioned so as to be flush with as the lower sides of the bent tongue parts 15. |
