| 摘要 |
PURPOSE:To manufacture a semiconductor laser device at a low cost wherein heat dissipation is excellent and miniaturization is easy. CONSTITUTION:A semiconductor laser element 13 is mounted on a heat sink 12 build in a stem 11, and covered with a cap 18 fixed on the stem 11. An aperture part 18a is formed on the upper surface of the cap 18, and fluid material 20 is filled into the cap 18 from the aperture part 18a. The aperture part 18a is closed with a glass board 19. |
