| 摘要 |
PURPOSE: To enable significant reduction in capacitive coupling and inductive coupling and impedance control of a signal transmission path. CONSTITUTION: The package has interleaved layers of conducive layers 206, 208 and 218 and a dielectric layer 220, which surround a die mounting region having specific dimensions. The package also has an array of external connectors, disposed by being spaced at standard intervals at one side of the package to surround the die-mounting region, a group of first via columns disposed spaced at the standard intervals and to electrically connect the external connectors with a specific signal path of a selected conductive layer, and a group of second via columns 214 disposed spaced at intervals smaller than the standard interval, adjacent to the corresponding columns of the first via column group. Thereby one of the columns in the first group and at least one via column 204 disposed adjacent thereto form a 2-wire transmission line. |
